The XPC P2 Series proudly wears the ICE & Oasis Cooling Technology logos. The cooling concept is embodied in a number of discreet Shuttle technologies, including; A Silent X PSU, Integrated Cooling Engine (ICE) and intelligently-engineered airflow mechanics.
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Air Flow
The XPC P2 Series introduces a revolutionary new approach to airflow design. Separating the machine into 4 airflow zones:
The airflow in the P2-chassis shows several different intake points designed to keep cool air continually flowing over critical components as opposed to recalculating warm stale air.
Finally, the underside of the P2-chassis has more air intake points designed to keep the motherboard cool and stable. The underside edge is lined with intake points. Other intake points are also located on the underside of the machine to improve motherboard cooling. |
Integrated Cooling Engine 2 (ICE 2) Technology
The Integrated Cooling Engine 2 (ICE 2) included in the P2 Series has been purpose designed for the P2-chassis. The Integrated Cooling Engine 2 uses convection cooling to transfer heat away from the processor and other critical system components. Copper tubing, coated in nickel and filled with distilled water provide the conduit through which heat the radiator, providing both processor cooling an passes to a radiator.
Improving on the standard ICE 2 module that ships with all G-series XPCs, the P2 series ICE module uses two fans in push-pull to more efficiently pass cool air over the ICE radiators fins. This makes it possible to deliver up to 50CFM. Further both fans are PWM spec — which means linear control of the fan speed — and controllable in BIOS.
Finally, those familiar with the XPC will notice that the ICE module has moved to the front of the case and the airflow has been redirected to exhaust on the left side of the machine. A Fan duct channels the intake airflow to ensure cool air is used to cool the CPU and a foam duct on the case makes sure the exhaust directly exits the case without warming other components. |
OASIS Cooling Technology
 Within the best performing platform is the top performance cooler, the newly designed Shuttle OASIS Cooling Technology delivers just that. Specially designed 3-part heat-sinks interconnected by convection cooling pipes covering the North Bridge, South Bridge and MOSFET modules effectively dissipate heat without the use for fans. Featuring all-new heat pipe designs, Shuttle OASIS allows users to enjoy longer component lifetime through lower temperatures and added system stability all in a silent operational environment. |
